Market Price: US $ 4.5/PC
• Composed of thousands of precise nanoparticles, specially designed for mobile phone maintenance
• 138℃: lead free material, support soldering under low temperature, environmental protection
• Silver containing formula, good viscosity, no blistering and solder bead
• 183℃: High temperature solder paste, strong tin climbing, round and full solder joint, bright lubrication
• Good conductivity and strong tin loading capacity, no residual, no clean, user-friendly, no need to rework ball planting
Specifications:
| Model | D-0008 | Model | G-0008 |
| Name | AX 138 lead free solder paste | Name | AX 183 nano solder paste |
| Brand | AiXun | Brand | AiXun |
| N.W. | 50G | N.W. | 50G |
| Melting point | 138℃ | Melting point | 183℃ |
| Element | No. 4 powder | Element | No. 4 power |
Features:
AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-183 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.
List of Packing:
1 x AX-138/183℃ PB free solder paste
Packing Details
100boxes/carton
Box dimension: 50*30*30mm
Carton dimension: 210*160*165mm
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